Track industry technology trends, define electrical design technology roadmaps for SiC power modules; Cooperate with team to complete the pre-research of advanced packaging solutions (Electrical design aspect), and organize electrical technical cooperation with universities and research institutes; Responsible for SiC power module electrical design, simulation and verification of power module packaging, and develop advanced electrical design technique with strong competitiveness in the industry; Responsible for solving difficult problems of power modules, such as oscillation, current sharing, system coupling and module reliability; Responsible for the investigation and dynamic tracking of forward-looking technology of power semiconductor packaging(electrical design aspect); Responsible for the development of sic mosfet chip simulation model, complete the simulation and verification of the dynamic characteristics of the chip model; Responsible for power chip selection, complete chip requirement development, chip screening and optimal patch strategy, and finally complete the batch production introduction and verification of new chips.